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4-Layer Flight Controller PCB Click to enlarge
4-Layer Flight Controller PCB 4-Layer Flight Controller PCB 4-Layer Flight Controller PCB 4-Layer Flight Controller PCB 4-Layer Flight Controller PCB
Description SpecificationsDFM GuidelinesBuying notes for this boardDownloads

Description

Built for flight-critical performance

Flight controllers run in a high-vibration, high-current, RF-dense environment. This 4-layer stack keeps the power plane away from the sensitive analog sensor layer and places a solid ground plane directly under the MCU, which keeps gyro and barometer traces quiet.

  • Stack-up: signal / GND / power / signal with 0.1 mm prepreg
  • Differential pairs routed at 90 Ω ±5 %, single-ended 50 Ω ±5 %
  • Via-in-pad filled and capped for BGA escape routing
  • Matte black solder mask + white silkscreen for AOI contrast
  • Panel size optimised to 2-up for cost-effective small batches

Ordering notes

Every panel is electrically tested with flying-probe equipment, and impedance coupons are measured and recorded for each production lot. Test reports travel with the shipment. Minimum order 5 pcs for prototyping; for series production above 500 pcs we can re-panel to improve material yield — please attach your expected annual volume in the inquiry form.

Specifications

Layer Count4 Layers
Base MaterialFR-4 TG170
Board Thickness1.6 mm ±10 %
Copper Weight1 oz / 1 oz
Min Trace / Space0.09 / 0.09 mm
Surface FinishENIG (Immersion Gold)
Min Drill0.20 mm
Impedance Tol.±5 %

DFM Guidelines

  • Minimum trace / space 0.09 mm — keep 0.10 mm where the stack allows
  • Annular ring ≥ 0.15 mm; via-in-pad must be filled and capped
  • Differential pairs: 90 Ω ±5 %; single-ended 50 Ω ±5 % — provide a stack-up if you have one
  • Silkscreen ≥ 0.15 mm line width; keep 0.20 mm clear of pads
  • Panel gap ≥ 1.6 mm; add 3 fiducials and 2 tooling holes for 2-up panels
  • Impedance coupons required on every panel for series production

Downloads

Datasheet (PDF) Download

Buying notes for this board

Can I order a bare board instead of a fully assembled board?

Yes. The same Gerber and stack-up review applies; we fabricate the board only on Dongguan-managed lines, with no component sourcing and no SMT.

What do you need to send us?

Gerber files plus a one-line note on quantity, layer count, thickness and surface finish. BOM and pick-and-place files are only needed if you also want assembly.

How fast is a prototype?

2-8 layer prototypes typically ship in about 48 hours after the files are confirmed; small batches run from 5 pcs to 5,000 pcs on the same QC checklist.

Which tests are done before shipping?

AOI on the bare board, plus FAI and X-ray where assembly is involved. Every order is inspected against the same ZiLian checklist.

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